Description

• Diode module patented structure design, providing smaller size, larger heat dissipation area, lower contact impedance,
  higher thermal escape ability;
• The thermal balance design of the intermediate box body avoids the local heating deformation of the junction box and ensures the safe operation of components and power stations to the greatest extent;
• The cable conductor and the conductor are connected by resistance welding process, which has low contact impedance and more reliable performance;
• Optimized trench process Schottky chip with higher reverse withstand voltage (VBR) lower forward voltage drops (VF), smaller reverse leakage current (IR) and faster switching speed;
• With different specifications of die chip size, the junction box provides a variety of rated current levels for selection, and can adapt to different component current specifications (ISC) requirements without changing the product size;
• TÜV/UL double certification guarantee.