Description

• The patented structure design of the diode module provides a smaller size, larger heat dissipation area, lower contact resistance, and higher heat escape capability;
• The heat balance design of the middle box body avoids partial thermal deformation of the junction box and guarantees the safe operation of the components and the power station to the greatest extent;
• Optimizing the internal space design of the box, which can provide a wide range of glue volume and can be adapted to the needs of the glue filling process of different components;
• Adopting Schottky chip with optimal trench technology, which can provide higher reverse withstand voltage (VBR), lower forward voltage (VF), smaller reverse leakage current (IR) and the faster switching speed at the same time ;
• By matching different specifications of die chip sizes,, the junction box provides a variety of rated current gears for selection; it can adapt to the ISC requirements of different component current specifications without changing the product outline size;
• Certificate of TÜV and UL;

For more detailed information, please consult info@omegasonnen.com